Fytronix Ix 9000 Spin Coater:-
Make: HE (NSIC Regd, MSME Regd, ISO 9001 – 2015/14001-2015/13485-2016/FDA/ GMP/CE Certified)
Model: HSC – 8000
Introduction
Anti-corrosion spin coater adopts PP chamber (Optional PTFE chamber), which is beautiful and sturdy in appearance, has excellent chemical stability and strong corrosion resistance, and can be used in various occasions requiring acid and alkali resistance and organic solvents. Anti-corrosion spin coater adopts advanced precision motor, the maximum speed can reach 6000 RPM / 8000 RPM/ 9999 RPM, which effectively guarantees the uniformity of film formation. In addition, the instrument adopts touch screen control and can preset the coating curve, which greatly simplifies the use process and reduces the learning cost. It is very suitable for laboratory purchase.
Application:-
The spin coater can coat liquid or colloidal materials on silicon wafers, crystals, quartz, ceramics and other substrates to form thin films. It is mainly used in photoresist spin coating, biological medium preparation, sol-gel method for polymer film production, etc.
Technical Specification: -
• Polypropylene Working Chamber (removable), size 6-inch dia, with transparent photo resist lid with interlock safety switch.
• 500 – 8000 RPM
• Accuracy<±0.5% of Full Speed
• Microprocessor Programmable Speed control with respect to time Preset editable programs of 8 program X 8 segments.
• Real time display of RPM, time and program stamps
• Nonvolatile program memory
• Input & control through soft touch key pad.
• Vacuum release switch
• Substrate size from 0. 04sq.inch (28 sq.mm) to 4.0 sq. inch (For glass substrate) & 20.0 sq. inch (for silicon
wafers)
• Vacuum chuck: derlin made circular substrate
holders of Dia
• 0.5”, 1”, 1.5”, 2.0” inch
• Microprocessor control A C brush less motor.
• Acceleration 2000 rpm/sec (Maximum) use settable.
• Calibration option.
• Vacuum Dial gauge.
• Frame: Epoxy coated MS.
• Facility for interlocking with Vacuum Pump.
• Tubing for Vacuum.
• Gas Purging Attachment for Nitrogen.
• Spill drainage facility
• To operate on 230V ± 10%, 1 phase 50 Hz AC only.
• Maximum Power 190W, Current 1.0 Amp.
With Vacuum Pump:
Model Technical Name Technical Parameters
HE115 N Flow rate 50 Hz 1.8CFM
51 l/min
60 Hz 2.0CFM
57 l/min
Ultimate vacuum Partial Pressure 2 Pa
Total Pressure 150 micron
Power ¼ HP
Inlet Port ¼” Flare
Keywords
¼ HP
60 Hz
50 Hz
4.0 sq
1 phase
20.0 sq
9999 RPM
6000 RPM
MSME Regd
NSIC Regd
Inlet Port
thin films
Full Speed
PP chamber
use process
Vacuum Pump
Vacuum chuck
learning cost
coating curve
maximum speed
500 – 8000 RPM
sol-gel method
silicon wafers
film formation
program stamps
Substrate size
Total Pressure
Current 1.0 Amp
glass substrate
size 6-inch dia
Epoxy coated MS
other substrates
organic solvents
150 micron Power
various occasions
alkali resistance
Vacuum Dial gauge
Real time display
Calibration option
Maximum Power 190W
soft touch key pad
colloidal materials
laboratory purchase
touch screen control
A C brush less motor
Vacuum release switch
Optional PTFE chamber
Microprocessor control
8 program X 8 segments
Gas Purging Attachment
Spill drainage facility
polymer film production
Technical Specification
interlock safety switch
photoresist spin coating
advanced precision motor
Nonvolatile program memory
Anti-corrosion spin coater
strong corrosion resistance
excellent chemical stability
Fytronix Ix 9000 Spin Coater
transparent photo resist lid
Polypropylene Working Chamber
biological medium preparation
time Preset editable programs
Ultimate vacuum Partial Pressure
silicon wafers
circular substrate holders
Microprocessor Programmable Speed control
Model Technical Name Technical Parameters HE115 N Flow rate
